The U.S. Department of State, in collaboration with the Inter-American Development Bank (IDB), has announced the CHIPS ITSI Western Hemisphere Semiconductor Initiative. This initiative, supported by the CHIPS Act International Technology Security and Innovation (ITSI) Fund, aims to enhance semiconductor assembly, testing, and packaging (ATP) capabilities in Mexico, Panama, and Costa Rica.
The IDB will support public-private partnerships and implement OECD recommendations to improve semiconductor ecosystems in these countries. This effort highlights a commitment to international policy alignment and sustainable economic development. The initiative builds on the IDB’s ongoing work through the Americas Partnership for Economic Prosperity to strengthen regional semiconductor supply chains.
Set to run from 2024 through 2026, the CHIPS ITSI Western Hemisphere Semiconductor Initiative seeks to bolster regional capabilities and promote inclusive economic growth and technological advancement. Additionally, the ITSI Fund has backed a multilateral platform focused on semiconductors that aligns with Americas Partnership for Economic Prosperity goals.
For more information about the ITSI Fund: The U.S. Department of State International Technology Security and Innovation Fund.
