Jeffrey Preston Bezos Executive Chairman of Amazon | Amazon
Amazon Web Services (AWS), a subsidiary of Amazon.com, Inc. (NASDAQ: AMZN), has announced an expanded collaboration with NXP Semiconductors to transition the majority of NXP’s electronic design automation (EDA) processes to AWS. This move builds on a three-year partnership, enabling NXP to utilize AWS's performance, scalability, and security features for semiconductor design in automotive, IoT, mobile, and communication sectors.
NXP has recently completed the deployment of its end-to-end semiconductor chip design on AWS. To facilitate this migration, NXP established a cloud center of excellence (CCoE) aimed at ensuring governance for cloud workloads, training employees, and standardizing application development.
By leveraging AWS’s global infrastructure capabilities in high-performance computing as well as artificial intelligence and machine learning services, NXP successfully executed a full system-on-a-chip design. This included simulation and tape-out for their advanced vehicle integration processor.
“We are excited to expand our relationship with AWS to power the next generation of EDA workloads in the cloud. Leveraging AWS’s portfolio of cloud services has been instrumental in accelerating our semiconductor innovation development and production cycles,” said Adhir Mattu, CIO and senior vice president at NXP Semiconductors. “Our engineers can dynamically provision the compute they need when they need it to power our most demanding EDA workloads. This has boosted productivity and time-to-market for our cutting-edge products.”
