Laurie E. Locascio
Recent News About Laurie E. Locascio
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The Biden-Harris Administration has announced two awards under the CHIPS Incentives Program, aimed at bolstering the U.S. semiconductor supply chain crucial for national security and the space industry.
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The Biden-Harris Administration has announced that the U.S. Department of Commerce is in talks to invest up to $300 million in advanced packaging research projects across Georgia, California, and Arizona.
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The Biden-Harris Administration has announced that the U.S. Department of Commerce is entering negotiations with the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) to establish a new Manufacturing USA institute in...
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The Department of Commerce and Natcast have announced that Sunnyvale, California, is the anticipated location for the CHIPS for America Design and Collaboration Facility (DCF), a part of the National Semiconductor Technology Center (NSTC).
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The Department of Commerce and Natcast have announced that the Albany NanoTech Complex in Albany, New York, operated by NY CREATES, will host the first CHIPS for America research and development flagship facility.
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The Biden-Harris Administration has launched a $100 million competition to enhance research and development in artificial intelligence (AI) and autonomous experimentation (AE) technologies for sustainable semiconductor materials.
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The Biden-Harris Administration has announced a preliminary agreement with Hemlock Semiconductor (HSC) to expand U.S. production capacity of semiconductor-grade polysilicon. The U.S. Department of Commerce and HSC have signed a non-binding preliminary memorandum of terms (PMT) for up to $325 million in proposed funding under the CHIPS and Science Act. This investment aims to enhance the domestic supply chain and create over 1,000 jobs in manufacturing and construction.
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The Biden-Harris Administration has announced a funding competition for up to $1.6 billion aimed at advancing U.S. semiconductor packaging technologies. This initiative is part of the CHIPS and Science Act, supporting the adoption of new advanced packaging flows within the U.S. semiconductor industry. The effort aligns with President Biden's Investing in America agenda, which focuses on enhancing American competitiveness and boosting future manufacturing industries.
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The Biden-Harris Administration has announced a preliminary agreement with Infinera to support the development of semiconductor technology, a move aimed at enhancing communications and national security. The Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed funding under the CHIPS and Science Act. This funding is intended to bolster America’s semiconductor manufacturing industry by supporting the construction of new facilities in San Jose, California, and Bethlehem, Pennsylvania.
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The Biden-Harris Administration has announced a preliminary memorandum of terms (PMT) with Wolfspeed, Inc. for up to $750 million in proposed funding under the CHIPS and Science Act. This funding aims to support the construction of a silicon carbide wafer manufacturing facility in Siler City, North Carolina. The initiative is part of efforts to secure a domestic supply chain for semiconductors essential for the future energy economy and AI technologies.
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The Biden-Harris Administration has announced a preliminary agreement with Edwards Vacuum to manufacture specialized dry vacuum pumps in the United States. This development is facilitated through a non-binding preliminary memorandum of terms (PMT) signed by the U.S. Department of Commerce and Edwards Vacuum, which could result in up to $18 million in proposed funding under the CHIPS and Science Act.