Lloyd J. Austin III Secretary of Defence | Official website
The Department of Defense has announced a substantial investment of $269 million in 33 new technical projects under the Microelectronics Commons (ME Commons) initiative. This funding, part of the CHIPS and Science Act, aims to bolster America's microelectronics manufacturing capabilities and workforce development. The Biden-Harris Administration's Investing in America Agenda seeks to reduce dependency on foreign microelectronics sources and enhance national security.
"Under the leadership of President Biden and Vice President Harris, we're creating a new chapter in semiconductor research and development here in America," said Arati Prabhakar, Chief Advisor for Science and Technology to the President. "These CHIPS and Science Act investments through the Microelectronics Commons will advance innovation for components that enable the most sophisticated defense systems, strengthening our national security. Today's awards are the next step forward in making sure that we win the future."
Established in 2023, ME Commons consists of eight regional hubs slated to receive $2 billion from FY23 to FY27. The initiative focuses on accelerating domestic microelectronics hardware prototyping and workforce development, equipping American workers with advanced skills for high-paying careers.
"Microelectronics are critical to our goals of having a more reliable microelectronics supply and delivering next-generation capabilities for our troops," said Dr. Devanand Shenoy, Executive Director of Microelectronics Commons. "These awards will also upskill America's workforce, thus helping keep America both secure and prosperous."
The $269 million is allocated across six technical areas: quantum ($32 million), secure edge computing ($25 million), 5G/6G ($42 million), electromagnetic warfare ($51 million), commercial leap-ahead ($38 million), artificial intelligence ($42 million), and a Cross-Hub Enablement Solution (CHES) award totaling $39 million.
Senior officials from the Department of Defense and White House will visit three hubs to discuss progress: Phoenix, Arizona on September 17; Boston, Massachusetts on September 18; Raleigh, North Carolina on September 19.
Since its inception last year with an initial investment just under $240 million, ME Commons has grown from approximately 400 members to over 1,200 organizations today. These include innovators, academic leaders, defense industrial base partners, government program managers, prototyping facilities, among others.
The initiative also focuses on transitioning technology across the "valley of death" as well as developing tailored workforce plans specific to each hub’s needs. Efforts include expanding education targeting smaller schools, community colleges, Historically Black Colleges and Universities (HBCUs), Minority-Serving Institutions (MSIs), reskilling veterans and professionals while providing opportunities for entry-level job seekers through specialized certificate programs.
Funding distribution spans across 28 states including Washington D.C. More information about ME Commons membership can be found at https://microelectronicscommons.org/.
Note: Leaders from the Office of the Under Secretary of Defense for Research will attend mini-road shows in Phoenix on September 17; Boston on September 18; Raleigh on September 19 to discuss ME Commons' future.
