The Biden-Harris Administration has announced a significant award to Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc. The U.S. Department of Commerce will provide up to $407 million in direct funding under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities. This funding is aimed at establishing an advanced packaging and test facility in Peoria, Arizona.
Amkor Technology is recognized as a leading U.S.-based outsourced semiconductor assembly and test company (OSAT). The new facility represents an investment of approximately $2 billion by Amkor and is expected to create around 2,000 manufacturing jobs, with over 2,000 additional jobs during the peak construction phase.
"Advanced packaging is a critical part of the semiconductor supply chain," said U.S. Secretary of Commerce Gina Raimondo. "Thanks to Amkor’s investment in Arizona, the U.S. will have the world’s most leading-edge packaging technologies for the first time."
National Economic Advisor Lael Brainard emphasized that "today’s award with Amkor secures critical advanced packaging technology needed to strengthen our leading-edge manufacturers."
Giel Rutten, President and CEO of Amkor, expressed satisfaction with finalizing terms for receiving CHIPS Act funding: "This new facility will serve as a critical cornerstone in establishing a robust semiconductor manufacturing supply chain within the United States."
CHIPS for America has distributed over $33 billion out of more than $36 billion proposed incentives funding across 21 states. These initiatives are projected to generate over 125,000 jobs nationwide.
For further details on these projects, visit the CHIPS for America website.
