The Department of Defense announced May 24 that that it has entered into a $10 million agreement with Six Sigma under the Defense Production Act (DPA) Title III authorities to help the U.S. microelectronics manufacturing capability.

The investment aligns with Executive Order 14017, America’s Supply Chains, and has a focus on supporting national and economic security efforts, according to a release by the DoD. Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy, spoke on the importance of this investment in meeting the needs of military and space programs operating in extreme thermal and vibration environments. The agreement enhances the resilience and integrity of the critical supply chains of the nation, and also supports developing a robust defense industrial base for national security objectives.

“This investment ensures critical DoD military and space programs operating in extreme thermal and vibration environments are available to meet the needs of American strategic interests," Taylor-Kale said. “It exemplifies the Department’s commitment to ensuring the resilience and integrity of our nation’s critical supply chains.”

Six Sigma is based in Milpitas, Calif., and will utilize the funding to expand the capacity of its copper solder column manufacturing and column attach processes. The expansion will enable the production of high-reliability Column Grid Array components, including Field Programmable Gate Arrays and Application Specific Integrated Circuits, crucial for military and aerospace applications.

The project, which will span 51 months, shows the DoD's commitment to strengthening critical supply chains and ensuring the availability of advanced technologies for American strategic interests.

The IBP is the top advisor to the Under Secretary of Defense for Acquisition and Sustainment for developing Department of Defense policies. It also executes small business programs, monitors and assess foreign investment impacts and executes various authorities.