U.S. Department of Commerce announced five new CHIPS Research and Development Office leaders.
The office was established by the Creating Helpful Incentives to Produce Semiconductors (CHIPS) for America Act of 2022, according to a June 6 news release. The five now make up the CHIPS R&D Office at the National Semiconductor Technology Center, the centerpiece of the bipartisan CHIPS and Science Act’s R&D program.
"While the manufacturing incentives of the CHIPS Act will bring semiconductor manufacturing back to the U.S., the CHIPS R&D programs will ensure America's global leadership by creating a robust semiconductor R&D ecosystem," Secretary of Commerce Gina Raimondo said in the release. "These leaders bring exactly the depth and breadth of organizational, programmatic and technical leadership experience that CHIPS needs to stand up new, transformational R&D programs."
CHIPS for America was created to revive semiconductor manufacturing in the U.S. and strengthen the nation's position in technology and innovation, the release reported.
The new office leaders were announced by National Semiconductor Technology Center Director Laurie E. Locascio during a June 6 meeting of the Industrial Advisory Committee, the release said.
“We are building a national R&D ecosystem that will keep our budding semiconductor manufacturing base one of the world’s most technologically advanced,” Locascio said in the release. “To make the CHIPS R&D programs into bustling centers of innovation, we need the country’s best people to execute our vision. These are the experts who will propel CHIPS for America and the nation’s semiconductor sector forward.”
According to the release, the new CHIPS R&D Office leaders are Director Lora Weiss, Deputy Director Eric Lin, Executive Officer Neil Alderoty, Associate Director for Integration and Policy Richard-Duane Chambers and CHIPS R&D Metrology Program Director Marla Dowell.
The new CHIPS for America Program Office is responsible for semiconductor incentives while the CHIPS R&D Office is responsible for four integrated programs that aims to generate innovations to make American semiconductor manufacturers globally competitive, the release said.
In addition to the National Semiconductor Technology Center, the other four integrated programs are the National Advanced Packaging Manufacturing Program, up to three new Manufacturing USA institutes dedicated to semiconductors and the CHIPS R&D Metrology Program, the release reported.
